| The Scanning Electron Microscope (SEM) has difficulty obtaining information on a variety of samples. One such situation is the case of a trench in a semiconductor wafer in which a SEM cannot view the bottom or the sidewall of the trench structure.
Using the unique AFM capabilities of the MultiView 400™ The operator of a SEM or FIB machine can ask, on line, questions about high aspect ratio structures (eg. side wall angles and the surface structure of these sidewall in a variety of important devices with vias and other structures.
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